PROBLEM TO BE SOLVED: To provide a mechanism for preventing the occurrence of crack and deformation of a support substrate for supporting a scintillator layer, when compression-bonding an imaging substrate and the scintillator layer.SOLUTION: A method for manufacturing a radiation imaging apparatus includes: a process for adhering a scintillator layer 130 which is formed on one surface of a support substrate 120 and converts incident X-rays into light to an imaging substrate 140 which holds a plurality of photoelectric conversion elements 142 for converting the light converted by the scintillator layer 130 into an electrical signal, by using a connection member 160 a process for arranging a protective member 110 for protecting the support substrate 120 on the other surface side of the support substrate 120 and a process for pressurizing the protective member 110 by using a roller 300 and compression-bonding the scintillator layer 130 and the imaging substrate 140 through the connection member 160.SELECTED DRAWING: Figure 3COPYRIGHT: (C)2018,JPO&INPIT【課題】撮像基板とシンチレータ層とを圧着する際に、シンチレータ層を支持する支持基板の割れや変形の発生を防止する仕組みを提供する。【解決手段】支持基板120の一方の面に形成された、入射したX線を光に変換するシンチレータ層130と、シンチレータ層130で変換された光を電気信号に変換する複数の光電変換素子142を保持する撮像基板140とを、接続部材160を用いて貼り合わせる工程と、支持基板120の他方の面側に、支持基板120を保護するための保護部材110を配置する工程と、ローラー300を用いて保護部材110を加圧して、シンチレータ層130と撮像基板140とを接続部材160を介して圧着する工程を実行する。【選択図】図3
