Lovejoy, Jr. James L.,Cencich Thomas Patrick,Kefauver W. Neill
申请号：
US201414260217
公开号：
US9906202(B1)
申请日:
2014.04.23
申请国别(地区):
美国
年份:
2018
代理人:
McDermott Will & Emery LLP
摘要：
A radio-frequency (RF) antenna with wideband impedance matching includes a first conductive layer, a second conductive layer, and patterned connections. The first conductive layer is formed on a first surface of a dielectric material. The second conductive layer is formed on a second surface of the dielectric material. The patterned connections between the first conductive layer and the second conductive layer are formed through multiple vias to enable the wideband impedance matching. The first conductive layer and the second conductive layer are formed based on an antenna-layout pattern. The multiple vias are formed based on a via pattern that corresponds to the antenna-layout pattern.
