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HOT-MELT ADHESIVE AGENT
专利权人:
HENKEL JAPAN LTD.
发明人:
MORIGUCHI, MASAHIRO,森口政浩,森口政浩,MAEDA, NAOHIRO,前田直宏,前田直宏
申请号:
TW103117715
公开号:
TW201504382A
申请日:
2014.05.21
申请国别(地区):
TW
年份:
2015
代理人:
摘要:
Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, excellent in adhesiveness at the wide temperature ranges (10 to 40℃), and excellent in balance between tackiness and retention force, and a disposable product obtained by employing the hot-melt adhesive agent. Means for Solving the problem is a hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and has a viscosity at 25℃ as 25% toluene solution of not more than 250 mPa.s and (A2) a triblock type styrene block copolymer.本發明欲解決之問題為提供一種能應用於低溫、於廣泛溫度範圍(10至40℃)具有極佳黏附力,以及黏著性和固持力之間具有極佳平衡之熱熔黏著劑,以及利用該熱熔黏著劑所獲得之可拋棄式用品。解決此問題之方法為利用一種包含一熱塑性嵌段共聚物(A),其係乙烯類芳香烴和共軛雙烯化合物之共聚物,之熱熔黏著劑,其中該熱塑性嵌段共聚物(A)包含下列成分(A1)和成分(A2):(A1)具有35至45%重量比苯乙烯含量、50至90%重量比雙嵌段含量,以及具有於25℃之25%苯乙烯溶液黏度不超過250mPa.s之輻射式苯乙烯嵌段共聚物;以及(A2)三嵌段式苯乙烯嵌段共聚物。
来源网站:
中国工程科技知识中心
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