Integrated circuits with edge assurance structures are provided for more reliable and efficient monitoring of the die edge integrity using, for example, Automatic (or Automated) Test Equipment (ATE). The edge assurance structures can be used to test, for example, all (100%) of the production materials with virtually no extra cycle time and cost. The edge assurance structure can be located around an edge of the integrated circuit. The edge assurance structure can include a plurality of v-shaped structures that are connected to each other using a plurality of ultra-thick vias. The integrated circuit can include a pad that is coupled to the edge assurance structure. The pad can be used to measure a resistance of the edge assurance structure.
