Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.在此所述的本揭露內容的特點係有關於封裝一超音波單晶片。在某些實施例中，一種設備係包含一具有直通矽穿孔(TSV)的超音波單晶片、以及一耦接至該超音波單晶片並且包含貫孔的中介體，其中該超音波單晶片係耦接至該中介體，使得在該超音波單晶片中的TSV係電連接至該中介體中的該些貫孔。在某些實施例中，一種設備係包含一具有焊墊的超音波單晶片、一具有焊墊並且耦接至該超音波單晶片的中介體、以及從在該超音波單晶片上的焊墊延伸至該中介體上的焊墊的引線接合。
