LIU, JIANWEI,刘 建威,劉 建威,FIFE, KEITH G.,法菲 凯斯 Ｇ,法菲 凱斯 Ｇ
申请号：
TW108123485
公开号：
TW202011897A
申请日:
2019.07.03
申请国别(地区):
TW
年份:
2020
代理人:
摘要：
Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.在此所述的是用於封裝超音波晶片的方法及設備。超音波晶片可以耦接至重分佈層以及中介層。囊封物可以囊封該超音波晶片的裝置，並且第一金屬柱可以延伸穿過該囊封物並且電耦接至該重分佈層。第二金屬柱可以延伸穿過該中介層。該中介層可包含鋁氮化物。該些第一金屬柱可以電耦接至該些第二金屬柱。印刷電路板可以耦接至該中介層。
