Disclosed herein is a multi-row ultrasonic probe of which a manufacturing failure rate can be decreased. The ultrasonic probe includes a piezoelectric layer configured to generate ultrasonic waves, a sound layer provided on a rear side of the piezoelectric layer, a flexible printed circuit board provided on a rear side of the sound layer, and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board. The piezoelectric layer includes a kerf configured to divide the piezoelectric layer in a direction of elevation. The sound layer includes a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer.
