To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 μm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200° C. for 30 minutes or after heating at 130° C. for 30 minutes or after heating at 300° C. for 30 minutes.
