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Strain sensor chip mounting structure, strain sensor chip and method of manufacturing a strain sensor chip mounting structure
专利权人:
HITACHI, LTD.
发明人:
Ohta Hiroyuki,Ashida Kisho
申请号:
US201214396399
公开号:
US9709377(B2)
申请日:
2012.04.23
申请国别(地区):
美国
年份:
2017
代理人:
Baker Botts L.L.P.
摘要:
Even when a strain sensor chip and an object to be measured are bonded to each other by using a metallic bonding material such as solder, the metallic bonding material shows the creep behavior when used under high temperature environment of, for example, 100° C. or higher, and therefore, the strain detected by the strain sensor chip is gradually reduced, and the strain is apparently reduced. In the strain sensor chip mounting structure which is one embodiment of the present application, a strain sensor chip is fixed onto a surface to be measured of the object to be measured via a metallic bonding material. And, the metallic bonding material is bonded to a metallic film that is formed on a side surface of the strain sensor chip. In this manner, temporal change in a measurement error can be suppressed.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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