Metal conducting structure and wiring structure

• 收藏
• 分享

专利权人:

Industrial Technology Research Institute

发明人:

Tsai Yuan-Ling,Chiang Ying-Jung,Yu Jiun-Jang

申请号：

US201514983484

公开号：

US9905327(B2)

申请日:

2015.12.29

申请国别(地区):

美国

年份:

2018

代理人:

摘要：

A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/