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Microneedle chip assembly, microneedle chip, medical instrument, microneedle chip assembly manufacturing method, and microneedle chip manufacturing method
专利权人:
凸版印刷株式会社
发明人:
竹村 信美,友野 孝夫,田村 章
申请号:
JP2007084266
公开号:
JP4985025B2
申请日:
2007.03.28
申请国别(地区):
JP
年份:
2012
代理人:
摘要:
<;P>;PROBLEM TO BE SOLVED: To provide a microneedle chip aggregate easy of management. <;P>;SOLUTION: The microneedle chip aggregate is constituted by arranging a large number of microneedle chips. By arranging a large number the microneedle chips, the microneedle chips can be formed into a sheet/tape shape to be produced/kept/transported. Accordingly, the damage of the microneedle chips caused by the mutual contact of the microneedle chips at the time of production/keeping/transport by forming the microneedle chips into the sheet/tape shape. Further, the necessity for the precise individual control of the microneedle chips can be reduced and the labor of control/keeping can be reduced. <;P>;COPYRIGHT: (C)2009,JPO&INPIT
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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