研磨用金属担持金属酸化物粒子および研磨剤

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专利权人:

日揮触媒化成株式会社

发明人:

熊澤 光章,小柳 嗣雄,俵迫 祐二,中山 和洋,吉田 聡,若宮 義憲,柏田 真吾

申请号：

JP20140071087

公开号：

JP6285775(B2)

申请日:

2014.03.31

申请国别(地区):

日本

年份:

2018

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a metal-carrying metal oxide particle which can be used suitably for polishing an aluminum disk, a silicon semiconductor wafer, and a compound semiconductor wafer or the like, and a production method thereof.SOLUTION: This invention provides a metal-carrying metal oxide particle in which a metal oxide particle with an average particle diameter in the range of 7-600 nm carries at least one metal selected from Ag, Pd, Au, Pt, Cu, and Fe in the range of 0.01-1200 pts. wt. as metal relative to the metal oxide particle of 100 pts. wt.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/