An automated mandrel dip coating process assembly for RTV silicone dispersions is described, including an enclosure adapted to hold a moisture-cure ambient temperature curable medium for mandrel dip molding and at least one mandrel having a surface for contacting the moisture-cure ambient temperature curable medium. An automated motive drive assembly is arranged to removably translate one or more of the mandrel(s) into contact with the moisture-cure ambient temperature curable medium in the enclosure, and to subsequently translate at least one mandrel contacted with the moisture-cure ambient temperature curable medium into at least one of (A) contact with a bubble crusher in the enclosure, and (B) disengagement from the moisture-cure ambient temperature curable medium in the enclosure and rotation of the mandrel at a vertical displacement angle of from 70° to 110°. By such arrangement, air bubble entrapment on the dip molded film on the mandrel is avoided, and controlled film thickness is achieved at desired location(s) so that the product molded film article is free of pinholes and air bubble inclusions in the film, and complies with desired thickness specifications.
