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Semiconductor package structure having a heat sink frame connected to a lead frame
专利权人:
GREAT TEAM BACKEND FOUNDRY (DONGGUAN), LTD.
发明人:
Cao Zhou
申请号:
US201415022055
公开号:
US9673138(B2)
申请日:
2014.09.26
申请国别(地区):
美国
年份:
2017
代理人:
Natter Seth`Natter & Natter
摘要:
A semiconductor package structure and forming method thereof; the semiconductor package structure includes a heat sink frame (2) and a lead frame (1), where the heat sink frame (2) is connected with a heat sink (4), a chip pad (21) of the lead frame (1) is adhered with a chip (3), and the heat sink (4) is connected to the chip (3) through a bonding material (5), and where the lead frame (1) is provided with a first lead (22), and the heat sink frame (2) is provided with a second lead (43) and a third lead (44). The method of forming the semiconductor package structure comprises: arranging the second lead (43) and the third lead (44) on the heat sink (4), and connecting the first lead (22) to the bottom electrode of the chip pad (21) to form a current input terminal; connecting three second lead (43) on the heat sink frame (2) to the top electrode of the chip (3) to form a current output terminal; welding the third lead (44) on the heat sink frame (2) with a conductive wire to form a current control terminal,
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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