FLUID EJECTION ASSEMBLY WITH CONTROLLED ADHESIVE BOND

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专利权人:

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人:

RIVAS, RIO,FRIESEN, ED

申请号：

EP20120884884

公开号：

EP2869994(A4)

申请日:

2012.09.19

申请国别(地区):

欧洲专利局

年份:

2016

代理人:

摘要：

In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

来源网站：

中国工程科技知识中心

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http://www.ckcest.cn/home/