METHODS AND SYSTEM FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D STRUCTURES, STRUCTURAL COMPONENTS, AND STRUCTURAL ELECTRONIC ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES
Board of Regents, The University of Texas System;Espalin, David
发明人:
ESPALIN, David,WICKER, Ryan, B.,MEDINA, Francisco,MACDONALD, Eric,MUSE, Danny, W.
申请号：
EP20140770931
公开号：
EP2974567(A4)
申请日:
2014.03.14
申请国别(地区):
欧洲专利局
年份:
2016
代理人:
摘要：
The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
