您的位置: 首页 > 农业专利 > 详情页

Ultrasonic probe as well as electronic apparatus and ultrasonic imaging apparatus
专利权人:
SEIKO EPSON CORPORATION
发明人:
Kanechika Kiyose
申请号:
US14920272
公开号:
US10074795B2
申请日:
2015.10.22
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An ultrasonic probe is provided that makes it possible to increase the shock resistance of a board of an ultrasonic device unit. An ultrasonic probe includes a housing. The housing defines an opening and an accommodation space that is continuous with the opening. An ultrasonic device unit is disposed in the accommodation space. A board has on its first surface an ultrasonic transducer that faces the opening. A rigid body is in contact with a second surface of the board and the housing. The rigid body has higher stiffness than the board.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充