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METHOD OF MANUFACTURING SILICON CARBIDE EPITAXIAL SUBSTRATE, METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE, AND SILICON CARBIDE EPITAXIAL SUBSTRATE MANUFACTURING DEVICE
专利权人:
SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人:
WADA, Keiji,DOI, Hideyuki,ITOH, Hironori
申请号:
WO2016JP72625
公开号:
WO2017056691(A1)
申请日:
2016.08.02
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要:
In a step of forming a silicon carbide layer, a first value and a second value belong in a quadrilateral region enclosed by first coordinates, second coordinates, third coordinates, and fourth coordinates in XY plane coordinates, where the X-axis represents the first value which expresses as a percentage a value obtained by dividing the flow rate of silane by the flow rate of hydrogen, and the Y-axis represents the second value which expresses the flow rate of ammonia in units of sccm. The first coordinates are (0.05, 6.5 × 10-4). The second coordinates are (0.05, 4.5 × 10-3). The third coordinates are (0.22, 1.2 × 10-2). The fourth coordinates are (0.22, 1.3 × 10-1). After the step of forming the silicon carbide layer, the silicon carbide layer has a carrier concentration average value of not less than 1 × 1015 cm-3 and not more than 2 × 1016 cm-3.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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