Provided are an ultrasonic probe and a method of manufacturing the same. The method includes: forming a plurality of grooves by removing regions of a first insulating layer and a first silicon wafer from a first substrate including the first silicon wafer and the first insulating layer； bonding a second substrate including a second silicon wafer, a second insulating layer, and a silicon thin layer to the first substrate, such that the plurality of grooves turn into a plurality of cavities； removing the second silicon wafer from the second substrate； forming transducer cells on regions of the second insulating layer corresponding to the plurality of cavities； and forming a plurality of unit substrates by cutting the first substrate, the silicon thin layer, and the second insulating layer.
