Rabih KHAZAKA,Stéphane AZZOPARDI,Donatien Henri Edouard MARTINEAU
申请号：
US16478326
公开号：
US20190358285A1
申请日:
2018.01.05
申请国别(地区):
US
年份:
2019
代理人:
摘要：
A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.
