An exemplary cochlear implant assembly includes an implantable cochlear stimulator (ICS) configured to apply electrical stimulation to a recipient by way of an electrode array. The ICS is housed in a casing that comprises a first surface area configured to serve as a current path to ground for the electrical stimulation and a second surface area. The cochlear implant assembly further includes an encapsulant that includes a conductive portion configured to cover the first surface area of the casing and be in conductive contact with the first surface area such that the conductive portion serves as the ground electrode and a non-conductive portion configured to cover the second surface area of the casing such that the casing is entirely disposed within the conductive and non-conductive portions of the encapsulant. Corresponding methods for manufacturing cochlear implant assemblies are also described.
