Jerry Ok,Robert J. Greenberg,Neil Hamilton Talbot,James S. Little,Rongqing Dai,Jordan Matthew Neysmith,Kelly H. McClure
申请号：
US14049056
公开号：
US20140039588A1
申请日:
2013.10.08
申请国别(地区):
US
年份:
2014
代理人:
摘要：
An implantable device, including a first electrically non-conductive substrate； a plurality of electrically conductive vias through the first electrically non-conductive substrate； a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias； a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps； a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps； discrete passives attached to the second electrically non-conductive substrate； and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.
