Jerry Ok;Robert J. Greenberg;Jordan Neysmith;Neil Hamilton Talbot;Da-Yu Chang;Kevin Wilkin
发明人:
Robert J. Greenberg,Jerry Ok,Jordan Neysmith,Kevin Wilkin,Neil Hamilton Talbot,Da-Yu Chang
申请号：
US11385314
公开号：
US08473048B2
申请日:
2006.03.20
申请国别(地区):
US
年份:
2013
代理人:
摘要：
The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.
