A camera is part of an appearance inspection apparatus which observes electronic components soldered to a printed circuit board from a position located directly above the electronic components. The apparatus includes an illuminating light which is emitted toward the electronic components. A laser beam which is emitted from a laser oscillator to an emission area overlaps a viewing field of a camera. The camera is for acquiring image data of the electronic component. Also included is a photo sensor which is disposed obliquely above the emission area which receives the reflected light of the laser beam which has been reflected by the solder. Also included is a moving apparatus for moving the printed circuit board in a horizontal direction relative to the camera and laser oscillator. The image data is acquired and the solder height is measured at substantially the same time. As a result, inspection time is shortened.
