SURFACE-TREATED COPPER FOIL FOR PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD

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专利权人:

FURUKAWA ELECTRIC CO., LTD.

发明人:

SAITO, Takahiro,EZURA, Takeshi

申请号：

WO2016JP86282

公开号：

WO2017099094(A1)

申请日:

2016.12.06

申请国别(地区):

世界知识产权组织国际局

年份:

2017

代理人:

摘要：

A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 μm or more but less than 0.5 μm, and the BET surface area ratio of the silane-coupling-agent-layer surface is 1.2 or higher.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/