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Endoscopic surgical instruments
专利权人:
Samsung Electronics Co.; Ltd.
发明人:
Byung June Choi,Yong Jae Kim,Jeong Hun Kim,Kyung Shik Roh,Se Gon Roh,Youn Baek Lee,Jong Won Lee
申请号:
US14202527
公开号:
US10390687B2
申请日:
2014.03.10
申请国别(地区):
US
年份:
2019
代理人:
摘要:
An endoscopic surgical instrument may include: two surgical instrument modules, each of which is provided with a surgical instrument portion; and/or an endoscopic module configured to form a triangular shape with the two surgical instrument modules and configured to capture operations of the surgical instrument modules at different angles using a plurality of joints. Wires connecting respective members coupled by the plurality of joints may be configured to amplify drive forces of a drive portion applied to the plurality of joints. The plurality of joints may include rolling joints at which teeth of gears engage and rotate with each other. The plurality of joints may provide three or more degrees of freedom to the endoscopic module.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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