Clips are provided to secure optic element systems to a printed circuit board. Associated mounting systems may, for example, eliminate direct adhesion of an optic element to an associated illumination source (e.g., LED). Thereby, thermal management of the system may be improved, adding flexibility in, for example, mounting height and tilt of an optic element. Thus, manufacturing cost, associated with mounting optic elements to L.E.D. arrays, may be reduced. Associated mounting systems may enable a direct electrical connection from a printed circuit to, for example, optical path control elements embedded within an optic element using, for example, various electro-optical control technologies.
