熱硬化性樹脂組成物、半導体装置および半導体装置の製造方法

• 收藏
• 分享

专利权人:

住友ベークライト株式会社

发明人:

村山 竜一,下邊 安雄,三戸手 啓二

申请号：

JP20120125388

公开号：

JP6111535(B2)

申请日:

2012.05.31

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in thermal conductivity and workability, and to provide a semiconductor device excellent in reliability.SOLUTION: There is provided a thermosetting resin composition for bonding a semiconductor device to a substrate. The composition includes thermoconductive particles, and satisfies D<6 μm when din volume-based particle size distribution of the thermoconductive particle by a flow type particle image analyzer is defined as D1, din number-based particle size distribution by the above image analyzer as D2, and a value subtracting D2 from D1 is defined as D.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/