Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD

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专利权人:

APPLIED Materials, Inc.

发明人:

Shaviv Roey,Emesh Ismail T.

申请号：

US201414527671

公开号：

US9768060(B2)

申请日:

2014.10.29

申请国别(地区):

美国

年份:

2017

代理人:

Christensen O'Connor Johnson Kindness PLLC

摘要：

In one embodiment of the present disclosure, a method for electrochemical deposition on a workpiece includes (a) obtaining a workpiece including a feature; (b) depositing a first conductive layer in the feature; (c) moving the workpiece to an integrated electrochemical deposition plating tool configured for hydrogen radical H* surface treatment and electrochemical deposition; (d) treating the first conductive layer using a hydrogen radical H* surface treatment in a treatment chamber of the plating tool to produce a treated first conductive layer; and (e) maintaining the workpiece in the same plating tool and depositing a second conductive layer in the feature on the treated first conductive layer in an electrochemical deposition chamber of the plating tool.

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