COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC EQUIPMENT, ROLLED COPPER ALLOY MATERIAL FOR ELECTRONIC EQUIPMENT, AND PART FOR ELECTRONIC EQUIPMENT

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专利权人:

MITSUBISHI MATERIALS CORPORATION

发明人:

MAKI Kazunari,ITO Yuki

申请号：

US201715414194

公开号：

US2017130309(A1)

申请日:

2017.01.24

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is given as X at %, an electrical conductivity σ (% IACS) is in a range of σ≦{1.7241/(−0.0347×X2+0.6569×X+1.7)}×100, and a stress relaxation rate at 150° C. after 1,000 hours is in a range of 50% or less.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/