High frequency circuit module in which high frequency circuits are embedded in a multilayer circuit substrate

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专利权人:

TAIYO YUDEN CO., LTD.

发明人:

Saji Tetsuo,Nakamura Hiroshi

申请号：

US201314063754

公开号：

US9866265(B2)

申请日:

2013.10.25

申请国别(地区):

美国

年份:

2018

代理人:

Chen Yoshimura LLP

摘要：

A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/