Provided is a sputtering target capable of reducing generation of particles resulting from abnormal discharge and arcing. This sputtering target is used for magnetron sputtering, and a plate-like member is detachably fitted in a non-erosion region located at the central portion of a target surface of the sputtering target. When the sputtering target is fitted in, the surface of the plate-like member on the target surface side is preferably almost flush with the target surface before the sputtering target is eroded or is preferably disposed at a position recessed from the target surface.
