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Structure and formation method of semiconductor device structure
专利权人:
Taiwan Semiconductor Manufacturing Co., Ltd.
发明人:
Chang Che-Cheng,Lin Chih-Han
申请号:
US201514827092
公开号:
US9614089(B2)
申请日:
2015.08.14
申请国别(地区):
美国
年份:
2017
代理人:
Birch, Stewart, Kolasch & Birch, LLP
摘要:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a protection element over the gate stack. A top of the protection element is wider than a bottom of the protection element. The semiconductor device structure also includes a spacer element over a side surface of the protection element and a sidewall of the gate stack. The semiconductor device structure further includes a conductive contact electrically connected to a conductive feature over the semiconductor substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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