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Microchip substance delivery devices having low-power electromechanical release mechanisms
专利权人:
发明人:
S. Jay Chey,Bing Dang,John U. Knickerbocker,Kenneth F. Latzko,Joana Sofia Branquinho Teresa Maria,Lavanya Turlapati,Bucknell C. Webb,Steven L. Wright
申请号:
US14483278
公开号:
US09937124B2
申请日:
2014.09.11
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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