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TRANSPARENT FILM FOR FLEXIBLE CIRCUIT BOARD, AND FLEXIBLE CIRCUIT BOARD
专利权人:
TOYOBO CO., LTD.
发明人:
NISHIO Akiko,HONGO Yuki
申请号:
WO2016JP65958
公开号:
WO2016199616(A1)
申请日:
2016.05.31
申请国别(地区):
世界知识产权组织国际局
年份:
2016
代理人:
摘要:
[Problem] To provide: a transparent film for a flexible circuit board, which is excellent in heat resistance and is suitable to form a circuit having a thinner wire; and a flexible circuit board. [Solution] A transparent film for a flexible circuit board characterized by including, on at least one surface of a polyester film, an undercoat layer made of a cured material containing an ultraviolet-curable resin composition, wherein the undercoat layer has a surface free energy of 20-40 mJ/m2, a surface roughness Ra of at most 10 nm, and a film thickness of 0.8-3.0 μm. A flexible circuit board wherein a circuit having a wire width of at most 30 μm is formed on the transparent film for the flexible circuit board.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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