Chip structure having bonding wire

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专利权人:

Industrial Technology Research Institute

发明人:

Lin Yu-Min,Lin Po-Chen,Chang Jing-Yao

申请号：

US201514668994

公开号：

US9484315(B2)

申请日:

2015.03.26

申请国别(地区):

美国

年份:

2016

代理人:

Jianq Chyun IP Office

摘要：

A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/