Chan Hung Tat,Yip Ka Ming,Chan Chit Yiu,Yee Kwok Wai
申请号：
US201615263655
公开号：
US9970114(B2)
申请日:
2016.09.13
申请国别(地区):
美国
年份:
2018
代理人:
Piskorski John J.
摘要：
Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.
