ELECTROLESS PLATING METHOD
- 专利权人:
- Rohm and Haas Electronic Materials LLC
- 发明人:
- Hakiri Yoshiyuki
- 申请号：
- US201715819144
- 公开号：
- US2018179633(A1)
- 申请日:
- 2017.11.21
- 申请国别(地区):
- 美国
- 年份:
- 2018
- 代理人:
- 摘要：
- A method of the present invention for performing an electroless plating on a substrate comprising the steps of:
- 来源网站：
- 中国工程科技知识中心
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