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COMPOSITION OF RICE TEMPURA FLOUR AND FOOD PROCESSING METHOD USING THE SAME
专利权人:
发明人:
WATANABE, YOSHIAKI,渡邉好章,渡邉好章
申请号:
TW106127794
公开号:
TW201811194A
申请日:
2017.08.16
申请国别(地区):
TW
年份:
2018
代理人:
摘要:
To provide a rice flour-based tempura flour composition that does not include wheat flour, and a food processing method using the composition. This rice flour-based tempura flour composition is characterized by comprising 2 parts by weight of silicon, 0.8-1.5 parts by weight of baking powder, 1.1-2.5 parts by weight of a sugar ester, 15-19.2 parts by weight of starch, 70.5-76 parts by weight of rice flour, 3.5-6.3 parts by weight of calcium lactate, and 0.05 parts by weight of carotene. The present invention also provides a food processing method using the composition.本發明提供一種不含麵粉的米粉油炸粉組成物及使用了該米粉油炸粉組成物之食品加工方法。本發明的米粉油炸粉組成物的特徵為,由矽2重量份、發粉0.8~1.5重量份、糖酯1.1~2.5重量份、澱粉15~19.2重量份、米粉70.5~76重量份、乳酸鈣3.5~6.3、胡蘿蔔素0.05重量份構成。又,提供一種使用了該米粉油炸粉組成物之食品加工方法。
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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