In a coil component, an inorganic layer which is provided on a lower surface side of a coil has a thermal conductivity higher than that of a resin layer with which an upper surface of the coil is covered and gaps between windings are filled. As a result, heat transfer from the inside of the coil to the outside is supplemented via the inorganic layer. That is, heat transfer of the coil via the inorganic layer is facilitated, and heat dissipation of the coil component improves.
