Byung Mok Kim,Bo Hee Kang,Ha Na Kim,Hiroshi Kodaira,Yuichiro Tanda,Satoshi Ozeki
申请号：
US15082091
公开号：
US09842975B2
申请日:
2016.03.28
申请国别(地区):
US
年份:
2017
代理人:
摘要：
A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
