Byung Mok Kim,Bo Hee Kang,Ha Na Kim,Hiroshi Kodaira,Yuichiro Tanda,Satoshi Ozeki
申请号：
US14496486
公开号：
US20150048262A1
申请日:
2014.09.25
申请国别(地区):
US
年份:
2015
代理人:
摘要：
A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.
