Byung Mok KIM,Bo Hee KANG,Ha Na KIM,Hiroshi KODAIRA
申请号：
US14035700
公开号：
US20140084182A1
申请日:
2013.09.24
申请国别(地区):
US
年份:
2014
代理人:
摘要：
Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
