In one preferred form of the present invention, there is provided a down-light system component (10) comprising: a portion (12) that is made from relatively high heat-conductivity material. The portion (12) is provided for conducting heat away from a light source (14) to a position on or underneath plasterboard or other ceiling material. The portion (14) is configured to dissipate heat in a manner maintaining a desirable operative temperature of the light source (14), to increase the lifetime of the light source.