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ソーワイヤの表面形状評価方法及び装置
专利权人:
福井県;アイテック株式会社
发明人:
橋本 賢樹,佐野 弘,小泉 将治
申请号:
JP20140065282
公开号:
JP6277385(B2)
申请日:
2014.03.27
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a surface shape evaluation method and device of a saw wire capable of evaluating the surface shape of the saw wire accurately, efficiently, and quantitatively.SOLUTION: The surface shape evaluation device of a saw wire includes: an edge processing unit 10 that axially divides a photographic image related to the saw wire surface on which an abrasive grain adheres into a plurality of regions, and colors a part corresponding to the edge of the abrasive grain by coloring processing of a low-luminosity pixel and a high-luminosity pixel on the basis of the average value of the luminosity in each divided region; an extraction processing unit 11 for drawing a circumscribing circle circumscribing the colored region having undergone the coloring processing so as to surround the colored region and extracting an abrasive grain part; and an evaluation processing unit 12 for evaluating the surface shape on the basis of the area and center position of the drawn circumscribing circle.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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