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COOLING STRUCTURE FOR INTEGRATED CIRCUITS AND METHODS FOR FORMING SUCH STRUCTURE
专利权人:
Raytheon Company
发明人:
Wahl Joseph M.,Mayberry Travis L.,Beninati Gregory G.
申请号:
US201514978358
公开号:
US2017178996(A1)
申请日:
2015.12.22
申请国别(地区):
美国
年份:
2017
代理人:
摘要:
A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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