Lu Xiaoyong,Long Chunping,Liu Chien Hung,Chan Yucheng,Li Xiaolong,Liu Zheng
申请号：
US201615321537
公开号：
US2017271171(A1)
申请日:
2016.03.07
申请国别(地区):
美国
年份:
2017
代理人:
摘要：
Embodiments of the present invention provide a method of processing a surface of a polysilicon and a method of processing a surface of a substrate assembly. The method of processing a surface of a polysilicon includes forming a material film on the surface of the polysilicon; and processing, by using a chemico-mechanical polishing technology, the surface of the polysilicon on which the material film is formed. The material film is selected such that the polysilicon is preferentially removed in a polishing process.
