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LIQUID PHASE BONDING OF A SILICON OR SILICON CARBIDE COMPONENT TO ANOTHER SILICON OR SILICON CARBIDE COMPONENT
专利权人:
LAM RESEARCH CORPORATION
发明人:
Joslin Steven M.,Langan Peter,Nithiananthan Vijay,Chen Jihong
申请号:
US201514839344
公开号:
US2017056994(A1)
申请日:
2015.08.28
申请国别(地区):
美国
年份:
2017
代理人:
摘要:
A method for creating and using an assembly includes arranging a bonding material between a first component and a second component. The first component, the bonding material and the second component are heated to a predetermined temperature for a predetermined period to melt the bonding material and to create an assembly. The predetermined temperature is at or greater than a melting temperature of the bonding material and less than a melting temperature of the first component and the second component. The method includes using the assembly inside a batch furnace of a substrate processing system or a processing chamber of a substrate processing system. The first component and the second component are made from a material selected from a group consisting of silicon and silicon carbide. The bonding material is selected from a group consisting of aluminum, gold, germanium, indium or an alloy of silicon and aluminum, gold, germanium, or indium.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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