Disclosed is a printed circuit board (10) comprising an insulating layer (45) and a conductor track (40). The printed circuit board (10) has a first section (15), a second section (20) and a third section (25), wherein the second section (20) is arranged between the first section (15) and the third section (25) and mechanically and electrically connects the first section (15) to the third section (25) such that a main plane of extension of the first section (15) is arranged at an incline to a main plane of extension of the third section (25). The conductor track (40) has a conductor layer (41) running over the sections (15, 20, 25) and is arc-shaped in the second section (20). At least in the second section (20), the conductor track (40) comprises an electrically conductive solder layer (85) which covers the conductor layer (41) at least in some sections. Also disclosed is a method for producing the printed circuit board (10).
