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Semiconductor device structures including staircase structures, and related methods and electronic systems
专利权人:
Micron Technology, Inc.
发明人:
Tanzawa Toru
申请号:
US201615095401
公开号:
US9905514(B2)
申请日:
2016.04.11
申请国别(地区):
美国
年份:
2018
代理人:
TraskBritt
摘要:
A semiconductor device structure comprises stacked tiers each comprising a conductive structure and an insulating structure longitudinally adjacent the conductive structure, at least one staircase structure having steps comprising lateral ends of the stacked tiers, and an opening laterally adjacent a first side of the at least one staircase structure and extending through the stacked tiers and continuously across an entire length of the at least one staircase structure. Conductive structures of the stacked tiers laterally extend from the steps of the at least one staircase structure completely across a second side of the at least one staircase structure opposing the first side to form continuous conductive paths laterally extending completely across the stacked tiers. Additional semiconductor device structures, methods of forming semiconductor device structures, and electronic systems are also described.
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